Aluminum Nitride film characteristics

• Brightness increased
• Reduction GaN growth time
• Widening of the epitaxial process rang，Improve yield

UVAT strengths

• High vacuum technique
• Cost-effective
• Provide ALN coating OEM
• Quality monitoring，measuring Lab：d.n.k，α-STEP，XRD，AFM，Spectroscope，Force measurement

Equipment specifications

• Coverage size: 420mm x 650mm
• Plant size: L 3.5M x W 2.2M x H 2.3M
• Capacity: 2” 300K/Mon
• Computation foundation: 24hr/26Day

Equipment characteristic

• System may match 2”, 4”, 6”fixture production
• Ultra-low temperature high-speed film formation
• Lowdamage Ag composite layers
• Grain small reflectivity
• Small foot plant
• Magnetic fluid transmission import
• Oil-free design
• Quick target change

Equipment specifications

• Coverage size: 420mm x 650mm
• Plant size: L 4.8M x W 2.3M x H 1.85M
• Capacity: 2” 45K/Mon
• Capacity: 4” 10K/Mon
• Computation foundation: 24hr/26Day

Equipment characteristic

• System may match 2”, 4”, 6”fixture production
• Ultra-low temperature high-speed film formation
• Lowdamage Ag composite layers
• Ultra-dense film Ag composite layers
• Grain small reflectivity
• Magnetic fluid transmission import
• Oil-free design
• Quick target change

Equipment specifications

• Coverage size: 350mm x 350mm
• Plant size: L 4.2M x W 2.5M x H 2.4M
• Capacity: Kioth-I100 2” 116K/Mon
• Capacity: Kioth-I200 2” 230K/Mon
• Computation foundation: 24hr/26Day

Equipment characteristic

• System may match 2”, 4”, 6”fixture production
• MMC Cathode equipped with automatic flip
• Sputter membrane may control small Grain
• ITO High film density、high penetration rate
• Sputter Multi ITO Thin film structure design
• Cathode I : Super Low Damage、Thin film
• Cathode II : Low Damage、Thin film、high-speed film formation
• Magnetic fluid transmission import
• Oil-free design

Equipment specifications

• Coverage size: 300mm x 300mm
• Plant size: L 4.8M x W 1.8M
• Capacity: UHS-20503C4 2” 78K/Mon
• Computation foundation: 22hr/26Day

Equipment characteristic

• System may match 2”, 4”, 6”fixture production
• Continuous sputtering system
• Lift-up cavity door for maintenance
• Automatic reflux system、Integrated automation
• Sputter film gauge uniformity
• Ag High film density、Reflectivity>91%
• Ag Reflect Thin film stacking design
• Magnetic fluid transmission import

Equipment specifications

• Coverage size: 250mm x 250mm x 10 side
• Plant size: L 3.5M x W 2.2M x H 2.6M
• Capacity: UFE-11005P2 2” 63K/Mon
• Computation foundation: 24hr/26Day

Equipment characteristic

• System may match 2”, 4”, 6”fixture production
• Multi-layer film、Thick film design
• Low Damage Magnetron Sputtering System
• Extremely thin film deposition、Uniformity stable
• Low temperature film formation、process temperature monitoring
• Modular design for maintenance
• Integrated automatic loading and unloading system
• Multilayer metal film thrust>50g

Product application category