Plasma etching equipment
Product Description
- Plasma dry etching equipment
- Surface modification, roughening, cleaning, deep hole etching
- Etching material：PP, PR, Dry Film, Epoxy,…(All kinds of polymeric substance)
- substrate：Wafer, Si, Glass, PP, PMMA,Cu…(All kinds of substrate)
Equipment characteristic
- In-line continuous-type design
- High aspect ratio etching direction, high ion energy
- Special structural design reduction electric arc，Increase plasma stability
- High Capacity、Low revolution cost
- Not special gas demand
- Modulized design，Customization
- Substrate size：21” x 24”
Product application category
Dry microplasma equipment
Product Description
- Plasma dry etching(Desmear，Descum)
- Surface modification, roughening
- Etching material：PP,PMMA,ABF,Epoxy,…(All kinds of polymeric substance)
- substrate：Wafer, Si, Glass, PP, PMMA,Cu…(All kinds of substrate)
Equipment characteristic
- Multi-piece design
- High Capacity、Low revolution cost
- Chemica Reactive Ion Etching
- Not special gas demand
- Modulized design，Customization
- Substrate size：21” x 24”
Product application category
Metal plasma equipment/Equation plasma equipment
Product Description
- Plasma dry etching
- Etching material: Cu, Ti, Ta, Si, SiO2,Pd…(All kinds of metal)
- Etching material:PP,PR,PMMA,ABF,Epoxy…(All kinds of polymeric substance)
- substrate: Wafer, Si, Glass, PP, PMMA, Cu…(All kinds of substrate)
Equipment characteristic
- High-speed dry etching process
- High cooling capacity，Low substrate deformation
- High aspect ratio etching direction(low side etching)
- High Capacity、Low revolution cost
- Modulized design，Customization
- Substrate size：4”, 6”, 8”,16” x 20”, 20” x 24”
Product application category
Surface modification/Surface cleaning/Roughening
產品說明
- Plasma dry etching
- Etching material: Cu, Ti, Ta, Si, SiO2,Pd…(All kinds of metal)
- Etching material:PP,PR,PMMA,ABF,Epoxy…(All kinds of polymeric substance)
- substrate: Wafer, Si, Glass, PP, PMMA, Cu…(All kinds of substrate)
Equipment characteristic
- High-speed dry etching process
- High cooling capacity，Low substrate deformation
- High aspect ratio etching direction(low side etching)
- High Capacity、Low revolution cost
- Modulized design，Customization
- Substrate size：4”, 6”, 8”,16” x 20”, 20” x 24”
Product application category
