Ti-Cu Seed layer In line Vacuum Sputtering Equipment
Product Description
Advanced packaging process:
- UBM(Under Bump Metallurgy)
- RDL(Redistribution Layer)
- Sputter Ti/Cu seed layer
Equipment characteristic
- Low temperature sputtering process
- Low output time/high capacity design
- Good sidewall coverage
- Good film adhesion
- Vehicle automatic return system
Product application category
Non Plating Line
Product Description
- Inline Sputter system
- Non Plating Line
- Coreless Substrate
Equipment characteristic
- InLine High THP
- Low cost
- Good uniformity、reproducibility
- Link automatic retractable board machine
- environmental friendly，energy saving
Product application category
High heat dissipation film_Nano silver sputtering
Product Description
- Inline Sputter system
- Multilayer metal structure
- Alloy strong adhesion effect (nano silver)
- Alloy heat conduction effect
Equipment characteristic
- Low temperature sputtering process
- Low output time/high capacity design
- Good partial coverage
- Good film adhesion
- Vehicle automatic reflux system
Product application category
Horizontal continuous EMI sputtering equipment
Product Description
- Inline Sputter system
- SIP EMI
- Thick film process(>5um)
Equipment characteristic
- High heat dissipation technology
low temperature sputtering process
- Low output time/high capacity design
- Good partial coverage
- Good film adhesion
- Vehicle automatic reflux system
- High coating quality
Product application category
Vertical plasma etching equipment
Product Description
- Vertical Plasma Etch Equipment(Inline system)
- Plasma Desmear-Plasma Via Desmear
- Plasma Descum-Dry Film Descum
Equipment characteristic
- PCB Substrate warpage suppression function
- Low temperature process，no uncleanness
- RF Anisotropic etching to overcome the problem of hole expansion
- Even gas distribution，good etching uniformity
- Clamping of ineffective areas on the periphery of the substrate
- Graphics capabilities L/S < 2um，Via< 30um
Product application category
Horizontal Plasma Etch Equipment
Product Description
- Horizontal Plasma Etch Equipment
- Plasma Dry Etch
-Dielectric Etch
-Plasma Metal Etch
-Fine line Etch
- Plasma Thin down
-Plasma ABF Etching
-Plasma EMC Etching
-Molding Compound Etching
- Plasma Desmear
-Plasma Via Desmear
- Plasma Descum
-Dry Film Descum
- Plasma Pre-treatment
-Contact Angle
-Wetting
Equipment characteristic
- High-speed dry etching process
- High etching uniformity
- Modular design to achieve low cost/low footprint
- Advanced packaging(Panel Fan-Out FOPLP/FOWLP)
- High-end carrier board application technology
- With semiconductor-grade EFEM configuration
Product application category
Vacuum Oven
Product Description
- Vacuum Oven
- Vacuum Degas
- Deep water vapor removal
- Material Curing
- Anti-oxidation
- Residual Gas Analyzer
Equipment characteristic
- Deep water and oxygen remove
- Multi-chip heating at the same time，high-capacity systematic design
- High uniform temperature design to avoid substrate stress warping
- Temperature and time may depend on parameter stylization control
- Immediate or end point residual water、oxygen value detection
- Foundation plate size and piece number customized according to needs
Product application category
